January 2013
|
Last major scrub for updated documents: January 2013 |
|
| Number | Revision | Date | Title |
| MIL-B-5087 |
B |
10/64 |
Bonding for Aerospace Systems |
| MIL-HDBK-5 |
J |
01/03 |
Metallic Materials and Elements (70MB) declared obsolete in 2005 and replaced by MMPDS at <projects.battelle.org/mmpds/> |
| MIL-HDBK-17 |
Composite Materials Handbook being superseded by CMH-17; see <www.cmh17.org> and <books.sae.org/book-r-422.set3> |
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|
Volume 1 |
F |
06/02 |
Polymer Matrix/Guidelines for
Characterization |
|
Volume 2 |
F |
06/02 |
Polymer Matrix/Materials
Propoerties |
|
Volume 3 |
F |
06/02 |
Polymer Matrix/Materials Usage,
Design and Analysis |
|
Volume 4 |
A |
06/02 |
Metal Matrix Composites |
|
Volume 5 |
- |
06/02 |
Ceramic Matrix Composites |
| MIL-HDBK-217 |
F Notice 2 |
02/95 |
Reliability Prediction of Electronic Equipment not maintained; more up-to-date (perhaps) data at <Quanterion Solutions Inc.> |
| MIL-HDBK-340 |
A |
04/99 |
Test Requirements for Launch & Space Vehicles, Vol 1 |
| MIL-HDBK-343 |
- |
02/86 |
Design, Construction, and Test
Requirements for One-of-a-Kind Spacecraft (aka DOD-HDBK-340) |
| MIL-M-38510 |
J |
11/91 |
Military Specification,
Microcircuits Not valid for new designs; see MIL-PRF-38535, et al |
| MIL-PRF-13830 | B | 01/97 |
Optical Component Inspection |
| MIL-PRF-19500 |
P1 |
05/12 |
Performance Specification,
Semiconductor Devices Search current QML/QPL here |
| MIL-PRF-31032 |
C1 |
04/18 |
Printed Circuit Board, General
Spec. |
|
MIL-PRF-31032/1 |
D3 |
03/20 |
Rigid, Multilayer, Thermosetting Resin |
| MIL-PRF-31032/2 |
D |
06/18 |
Rigid, Double Layer, Woven E-Glass |
| MIL-PRF-31032/3 |
D |
06/18 |
Flexible, Double Layer |
| MIL-PRF-31032/4 |
D1 |
08/22 |
Flexible, Multilayer |
| MIL-PRF-31032/5 |
B |
10/17 |
Rigid, Multilayer, Thermoplastic, High-Frequency |
| MIL-PRF-31032/6 |
B |
10/17 |
Rigid, Double Layer, Thermoplastic, High Frequency |
| MIL-PRF-38534 |
L |
12/19 |
Performance Specification,
Hybrid Circuits |
| MIL-PRF-38535 |
M |
11/22 |
Performance Specification,
Integrated Circuits |
| MIL-PRF-55110 |
J |
05/20 |
Performance Specification, Printed Wiring Board, Rigid |
| MIL-STD-202 |
G |
02/02 |
Test Method Standad, Electronic
Parts |
MIL-STD-461 |
C |
08/86 |
Control of Electromagnetic Interference |
| E |
08/99 |
Control of Electromagnetic
Interference |
|
| Draft |
06/99 |
461E Draft in MSWord Format |
|
| XREF |
03/01 |
Comparison of 461E with other
standards |
|
| F |
12/07 |
Control of Electromagnetic Interference |
|
| MIL-STD-462 |
D |
01/93 |
Measurement of Electromagnetic Interference Characteristics; Obsolete |
| MIL-STD-464 |
C |
12/10 |
Electromagnetic Environmental Effects Requirements for Systems |
MIL-STD-750 |
F |
01/12 |
Test Methods for Semiconductor Devices |
| Part 1 |
01/12 | Environmental Methods |
|
| Part 2 |
11/12 | Mechanical Methods |
|
| Part 3 |
01/12 | Transistor Electrical Methods |
|
| Part 4 |
03/12 | Diode Electrical Methods |
|
| Part 5 |
01/12 | Space Application Methods |
|
| MIL-STD-810 |
G |
10/08 |
Test Method Standard/Env. Eng. Tests |
MIL-STD-883 |
H |
02/10 |
Test Method Standard/Microcircuits |
| 1000-1034 |
02/10 | Detailed Methods |
|
| 2000-2017 |
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| 2018 |
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| 3000-4007 |
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| 5000-5009 |
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| 5010-5013 |
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| MIL-STD-1246 |
C | 04/94 |
Cleanliness Levels Superseded by IEST-STD-CC1246E |
| Notice 1 |
05/94 |
||
| Notice 2 |
12/94 |
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| Notice 3 |
06/98 |
||
| Notice 4 |
02/02 |
||
| MIL-STD-1540 |
D |
01/99 |
Test Requirements for Launch 7 Space Vehicles (Rev E has been released, but is restricted access) |
| E-Draft |
12/02 |
||
| MIL-STD-1553 |
B |
09/76 |
Multiplex
Data Bus |
| Notice 1 |
02/80 |
||
| Notice 2 |
09/86 |
||
| Notice 3 |
01/93 |
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| Notice 4 |
01/96 |