MIL-STD Reference Documents

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Last major scrub for updated documents:
     January 2013
Locations of visitors to this page
 

Number Revision Date Title
MIL-B-5087
B
10/64
Bonding for Aerospace Systems
MIL-HDBK-5
J
01/03
Metallic Materials and Elements (70MB)
    declared obsolete in 2005 and replaced by MMPDS at
   <projects.battelle.org/mmpds/>
MIL-HDBK-17


Composite Materials Handbook
   being superseded by CMH-17; see
   <www.cmh17.org> and <books.sae.org/book-r-422.set3>
        Volume 1
F
06/02
Polymer Matrix/Guidelines for Characterization
        Volume 2
F
06/02
Polymer Matrix/Materials Propoerties
        Volume 3
F
06/02
Polymer Matrix/Materials Usage, Design and Analysis
        Volume 4
A
06/02
Metal Matrix Composites
        Volume 5
-
06/02
Ceramic Matrix Composites
MIL-HDBK-217
F Notice 2
02/95
Reliability Prediction of Electronic Equipment
    not maintained; more up-to-date (perhaps) data at
    <theriac.org/riacapps/search/>
MIL-HDBK-340
A
04/99
Test Requirements for Launch & Space Vehicles, Vol 1
MIL-HDBK-343
-
02/86
Design, Construction, and Test Requirements for
One-of-a-Kind Spacecraft
MIL-M-38510
J
11/91
Military Specification, Microcircuits
    Not valid for new designs; see MIL-PRF-38535, et al
MIL-PRF-13830 B 01/97
Optical Component Inspection
MIL-PRF-19500
P1
05/12
Performance Specification, Semiconductor Devices
    Search current QML/QPL here
MIL-PRF-31032
B1
05/12
Printed Circuit Board, General Spec.
Supplement 1
-
01/10
    List of Associated Specifications
MIL-PRF-31032/1
C1
11/12
    Rigid, Multilayer, Thermosetting Resin
MIL-PRF-31032/2
B1
11/12
    Rigid, Double Layer, Woven E-Glass
MIL-PRF-31032/3
B1
11/12
    Flexible, Double Layer
MIL-PRF-31032/4
B1
11/12
    Flexible, Multilayer
MIL-PRF-31032/5
A
09/12
    Rigid, Multilayer, Thermoplastic, High-Frequency
MIL-PRF-31032/6
A
12/12
    Rigid, Double Layer, Thermoplastic, High Frequency
MIL-PRF-38534
H
09/10
Performance Specification, Hybrid Circuits
MIL-PRF-38535
J
05/12
Performance Specification, Integrated Circuits
MIL-PRF-55110
G Notice 3
02/08
Performance Specification, Printed Wiring Board, Rigid
QPL-55110
-
1/10
            Qualified Manufacturers List
MIL-STD-202
G
02/02
Test Method Standad, Electronic Parts


MIL-STD-461


C
08/86
Control of Electromagnetic Interference
E
08/99
Control of Electromagnetic Interference
Draft
06/99
461E Draft in MSWord Format
XREF
03/01
Comparison of 461E with other standards
F
12/07
Control of Electromagnetic Interference
MIL-STD-462
D
01/93
Measurement of Electromagnetic Interference Characteristics; Obsolete



MIL-STD-750
F
01/12
Test Methods for Semiconductor Devices
Part 1
01/12
    Environmental Methods
Part 2
11/12
    Mechanical Methods
Part 3
01/12
    Transistor Electrical Methods
Part 4
03/12
    Diode Electrical Methods
Part 5
01/12
    Space Application Methods
MIL-STD-810
G
10/08
Test Method Standard/Env. Eng. Tests




MIL-STD-883

H
02/10
Test Method Standard/Microcircuits
1000-1034



02/10







    Detailed Methods
2000-2017
2018
3000-4007
5000-5009
5010-5013
MIL-STD-1246

C 04/94
Cleanliness Levels
    Superseded by IEST-STD-CC1246E
Notice 1
05/94
Notice 2
12/94
Notice 3
06/98
Notice 4
02/02
MIL-STD-1540
D
01/99
Test Requirements for Launch 7 Space Vehicles
     (Rev E has been released, but is restricted access)
E-Draft
12/02
MIL-STD-1553
B
09/76
Multiplex Data Bus
Notice 1
02/80
Notice 2
09/86
Notice 3
01/93
Notice 4
01/96

This page was last edited by Bob Goeke on  29 October 2013
There have been 30944 accesses to this page since 1/15/2013.